6:15 PM - 6:30 PM
[18p-D103-19] Stress Characterization of SiO2 / SiC interface by Scanning Near-Field Optical Raman Microscope
Keywords:Silicon Carbide, SiC, stress
In order to characterize the residual stresses in SiO2 / SiC interface, the scanning near-field optical Raman microscope with the nanometer-scale resolution has been utilized. The tensile stress exists in the SiC up to 300 nm form the SiO2 interface. The residual tensile stress due to the difference of the thermal expansion coefficients between SiO2 and SiC is estimated to be about 55 MPa.