The 65h JSAP Spring Meeting, 2018

Presentation information

Oral presentation

13 Semiconductors » 13.7 Compound and power electron devices and process technology

[19p-C302-1~18] 13.7 Compound and power electron devices and process technology

Mon. Mar 19, 2018 1:45 PM - 6:30 PM C302 (52-302)

Kozo Makiyama(Fujitsu Lab.), Masashi Kato(NITech)

2:45 PM - 3:00 PM

[19p-C302-5] Demonstration of vertical GaN MOSFET fabricated by Mg ion implantation

Ryo Tanaka1, Shinya Tanashima1, Katsunori Ueno1, Hideaki Matsuyama1, Masaharu Edo1, Kiyokazu Nakagawa2 (1.Fuji Electric, 2.Univ. of Yamanashi)

Keywords:Gallium Nitride, Ion implantation, MOSFET

We report the characteristics of the vertical GaN MOSFET fabricated on the partially Mg implanted n-GaN epitaxial layers. As for the Mg implantation, a BOX profile with a concentration of 1E18 cm-3 and a depth of 500 nm was used. Normally-off MOSFET operation with Vth ~ 9V has been observed with SiO2 gate insulator. The on-resistance was proportional to the channel length, so it has been confirmed that the device characteristics can be controlled by design dimensions.