[19a-E304-1~12] 13.4 Si processing /Si based thin film / MEMS / Equipment technology

△ [19a-E304-10] Low-height microbump bonding for 3D integration with fine-pitch electrodes

〇Yuki Miwa¹, Sungho Lee², Rui Liang¹, Kousei Kumahara¹, Hisashi Kino³, Takafumi Fukushima², Tetsu Tanaka^1,2 (1.Grad. Sch. of Biomedical Engineering, Tohoku Univ., 2.Grad. Sch. of Engineering, Tohoku Univ., 3.FRIS, Tohoku Univ.)

Keywords:microbump, 3D, fine-pitch

Now that Moore's law has faced its limit, system-level integration has attracted much attention for the development of electron devices. 3D- integration technology using TSVs is especially expected to play an important role to enhance the performances. Fine-pitch microbump is required for high-density 3D interconnection, which is one of the key technologies to realize high-performance 3D integration system. However, capillary underfilling has been becoming difficult as fine-pitch bumps are fabricated. In this study, we evaluated low-height microbump bonding using ultra-thin NCF, which can provide the microbump interconnection with further scaling.