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[20a-B31-5] Low temperature fabrication of In–Ga–Zn–O thin film transistor with anodic–Al2O3
Keywords:TFT
In this research, we succeeded in the fabrication of TFT that performs all processes at 150 ° C or less.
It has been proved that hydrogen addition at the time of IGZO film formation acts as a carrier suppression, and ON / OFF at 150 ° C is possible.Al2O3 is used a gate insulater which has a high dielectric constant and can be formed at room temperature by anodic oxidation, compared to CVD-SiO2.By combining these, a process technology of 150 ° C or less was realized.
It has been proved that hydrogen addition at the time of IGZO film formation acts as a carrier suppression, and ON / OFF at 150 ° C is possible.Al2O3 is used a gate insulater which has a high dielectric constant and can be formed at room temperature by anodic oxidation, compared to CVD-SiO2.By combining these, a process technology of 150 ° C or less was realized.