Yuki Miwa

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Speaker, Author, Co-Author

Sun. Mar 10, 2019 1:45 PM - 5:00 PM S221 (S221)

Oral presentation
| 13 Semiconductors
| 13.5 Semiconductor devices/ Interconnect/ Integration technologies

[10p-S221-1~10] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

4:45 PM - 5:00 PM

△ [10p-S221-10] Technology Platform Development of Multichip-to-Wafer 3D Integration (3)
- Microbump Bonding Technology for Heterogeneous Integration -

〇Yuki Miwa¹, Sungho Lee², Rui Liang³, Hisashi Kino⁴, Takafumi Fukushima², Tetsu Tanaka^2,3 (1.Sch. of Engineering, Tohoku Univ., 2.Grad. Sch. of Engineering, Tohoku Univ., 3.Grad. Sch. of Biomedical Engineering, Tohoku Univ., 4.FRIS, Tohoku Univ.)