[10p-S221-1~10] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

△ [10p-S221-10] Technology Platform Development of Multichip-to-Wafer 3D Integration (3)
- Microbump Bonding Technology for Heterogeneous Integration -

〇Yuki Miwa¹, Sungho Lee², Rui Liang³, Hisashi Kino⁴, Takafumi Fukushima², Tetsu Tanaka^2,3 (1.Sch. of Engineering, Tohoku Univ., 2.Grad. Sch. of Engineering, Tohoku Univ., 3.Grad. Sch. of Biomedical Engineering, Tohoku Univ., 4.FRIS, Tohoku Univ.)

Keywords:Multichip-to-Wafer