[10p-S221-1~10] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

△ [10p-S221-8] Technology Platform Development of Multichip-to-Wafer 3D Integration (1)
- Multichip Thinning Technology with Temporary Adhesive -

〇Sungho Lee¹, Rui Liang², Yuki Miwa³, Hisashi Kino⁴, Takafumi Fukushima¹, Tetsu Tanaka^1,2 (1.Grad. Sch. of Engineering, Tohoku Univ., 2.Grad. Sch. of Biomedical Engineering, Tohoku Univ., 3.Sch. of Engineering Tohoku Univ., 4.FRIS, Tohoku Univ.)

Keywords:Multichip-to-Wafer