The 66th JSAP Spring Meeting, 2019

Presentation information

Poster presentation

13 Semiconductors » 13.5 Semiconductor devices/ Interconnect/ Integration technologies

[11a-PB3-1~11] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

Mon. Mar 11, 2019 9:30 AM - 11:30 AM PB3 (PB)

9:30 AM - 11:30 AM

[11a-PB3-2] Transient Analysis by using TCAD on Super-Steep SS “PN-Body-Tied SOI-FET”

Takayuki Mori1, Jiro Ida1, Hiroki Endo1 (1.Kanazawa Inst. of Tech.)

Keywords:floating body effect, SOI MOSFET, steep subthreshold slope