The 66th JSAP Spring Meeting, 2019

Presentation information

Poster presentation

13 Semiconductors » 13.5 Semiconductor devices/ Interconnect/ Integration technologies

[11a-PB3-1~11] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

Mon. Mar 11, 2019 9:30 AM - 11:30 AM PB3 (PB)

9:30 AM - 11:30 AM

[11a-PB3-3] Fabrication technologies and characteristic control of SiGe HEMT formed by sputter epitaxy

Yosuke Aoyagi1, Akira Motohashi1, Kyohei Degura1, Katsumi Okubo1, Nobumitsu Hirose2, Akifumi Kasamatsu2, Toshiaki Matsui2, Yoshiyuki Suda1, Takahiro Tshukamoto3 (1.Tokyo Univ. of Agric. & Technol., 2.National Inst. of Information and Communications Technol., 3.Univ. Electro-Comm.)

Keywords:semiconductor