The 66th JSAP Spring Meeting, 2019

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si processing /Si based thin film / MEMS / Equipment technology

[11a-W934-1~11] 13.4 Si processing /Si based thin film / MEMS / Equipment technology

Mon. Mar 11, 2019 9:00 AM - 11:45 AM W934 (W934)

Hiromu Ishii(Toyohashi Univ. of Tech.), Minoru Sasaki(Toyota Tech. Inst.)

9:30 AM - 9:45 AM

[11a-W934-3] Effects of Ti/Au Layered Structure on Temperature Dependence of Micro-Cantilever Structure Stability

Hitomi Watanabe1, Takuma Suzuki1, Chun-Yi Chen1, Tso-Fu Mark Chang1, Daisuke Yamane1, Toshifumi Konishi2, Katsuyuki Machida1, Hiroyuki Ito1, Kazuya Masu1, Masato Sone1 (1.Tokyo Tech, 2.NTT AT Corp.)

Keywords:MEMS, Au, SEM