The 66th JSAP Spring Meeting, 2019

Presentation information

Poster presentation

13 Semiconductors » 13.7 Compound and power electron devices and process technology

[11p-PB3-1~27] 13.7 Compound and power electron devices and process technology

Mon. Mar 11, 2019 1:30 PM - 3:30 PM PB3 (PB)

1:30 PM - 3:30 PM

[11p-PB3-1] Trapping reduction of SiO2/GaN MOS structure by high pressure water vapor annealing

〇(DC)LIN TENGDA1, Mutsunori Uenuma1, Yasuaki Ishikawa1, Yukiharu Uraoka1 (1.Nara Institute of Science and Technology)

Keywords:GaN-SiO2 MOS, reliability, post annealing

High pressure water vapor annealing (HPWVA) is applyed and aimed to improve the reliability of GaN/SiO2 MOS structure. Through the constant current stressed time dependent dielectric breakdown (TDDB) measurements and a kinetic theoretical analysis, HPWVA sample exhibit longer lifetime and smaller electron trapping behavior.