The 66th JSAP Spring Meeting, 2019

Presentation information

Oral presentation

8 Plasma Electronics » 8.2 Plasma deposition of thin film, plasma etching and surface treatment

[11p-W641-1~14] 8.2 Plasma deposition of thin film, plasma etching and surface treatment

Mon. Mar 11, 2019 1:45 PM - 5:30 PM W641 (W641)

Daisuke Ogawa(Chubu Univ.), Kazunori Shinoda(HITACHI)

4:30 PM - 4:45 PM

[11p-W641-11] Etching reactions of Si, SiO2, and SiN films using with hydrofluorocarbon compounds

〇(M1)Jiawei Ni1, Toshio Hayashi1, Kenji Ishikawa1, Takayoshi Tsutsumi1, Hiroki Kondo1, Makoto Sekine1, Masaru Hori1 (1.Nagoya University)

Keywords:Etching characteristics, poly-Si , SiO2 and SiN