The 66th JSAP Spring Meeting, 2019

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Oral presentation

13 Semiconductors » 13.7 Compound and power electron devices and process technology

[12a-M121-1~9] 13.7 Compound and power electron devices and process technology

Tue. Mar 12, 2019 9:00 AM - 11:30 AM M121 (H121)

Keita Konishi(Tokyo Univ. of Agri. and Tech.)

11:00 AM - 11:15 AM

[12a-M121-8] Formation of Diamond/Cu direct bonding for power device application

〇Jianbo Liang1, Shinji Kanda1, Satoshi Masuya2, Makoto Kasu2, Naoteru Shigekawa1 (1.Osaka City Univ., 2.Saga Univ.)

Keywords:diamond, diamond/Cu direct bonding, heat sink