[9a-M114-1~12] 13.4 Si processing /Si based thin film / MEMS / Equipment technology

[9a-M114-11] Considerations of ultrapure water quantity optimization for wafer cleaning

〇Tomoaki Kageyama^1,3, Kazumasa Nemoto², Sommawan Khumpuang^2,3, Shiro Hara^2,3, Sang-Seok Lee¹ (1.Tottori Univ., 2.MINIMAL, 3.AIST)

Keywords:cleaning, Minimal fab

In semiconductor manufacturing, the current cleaning process utilizes a large amount of water, but in Minimal fab, the amount of ultrapure water used is reduced because ultrapure water stored inside the equipment. There is a problem that the process time is prolonged for reliable cleaning. In this presentation, we report attempt to optimize the cleaning process by estimating the state of the substrate surface during cleaning by using water quality sensor fabricated by Minimal fab.