The 66th JSAP Spring Meeting, 2019

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13 Semiconductors » 13.5 Semiconductor devices/ Interconnect/ Integration technologies

[9p-S221-1~15] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

Sat. Mar 9, 2019 1:45 PM - 5:45 PM S221 (S221)

Jiro Ida(Kanazawa Inst. of Tech.), Noriyuki Taoka(AIST)

5:00 PM - 5:15 PM

[9p-S221-13] The impact of backside Si passivation on UTB-GeOI channel

〇WENHSIN CHANG1, Toshifumi Irisawa1, Hiroyuki Ishii1, Noriyuki Uchida1, Tatsuro Maeda1 (1.AIST)

Keywords:GeOI, Si passivation, UTB