The 81st JSAP Autumn Meeting, 2020

Presentation information

Oral presentation

8 Plasma Electronics » 8.2 Plasma deposition of thin film, plasma etching and surface treatment

[10a-Z03-1~8] 8.2 Plasma deposition of thin film, plasma etching and surface treatment

Thu. Sep 10, 2020 9:00 AM - 11:00 AM Z03

Takayuki Ohta(Meijo Univ.)

10:30 AM - 10:45 AM

[10a-Z03-7] Reduction of MWCNTs wall thickness by plasma treatment

Kohei Nishimura1, Daisuke Ogawa1, Keiji Nakamura1, Hideo Uchida1 (1.Chubu Univ.)

Keywords:carbon nanotube, Plasma

In this study, there are some parts that have inferior mechanical and electrical properties compared to single-walled carbon nanotubes, but by using multi-walled carbon nanotubes with extremely high production efficiency and performing plasma treatment, We investigated the reduction of wall thickness by plasma treatment for the purpose of controlling the wall thickness.