The 81st JSAP Autumn Meeting, 2020

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si processing /Si based thin film / MEMS / Equipment technology

[10p-Z10-1~17] 13.4 Si processing /Si based thin film / MEMS / Equipment technology

Thu. Sep 10, 2020 12:30 PM - 5:30 PM Z10

Kuniyuki Kakushima(Tokyo Tech), Tatsuya Okada(Univ. of the Ryukyus)

4:00 PM - 4:15 PM

[10p-Z10-12] Application of Meniscus Force Mediated Layer Transfer to Roll-to-Roll process

〇(M2)Ryuji Kawakita1, Hiroaki Hanafusa2, Yuri Mizukawa2, Seiichiro Higashi2 (1.AdSM,Hiroshima Univ., 2.AdSE,Hiroshima Univ.)

Keywords:semiconductor, Roll-to-Roll

Flexible electronics have been developed with materials such as amorphous silicon (a-Si), organic, and oxide semiconductor that can be fabricated at a low temperature. Compared with these materials, Single-crystalline silicon (c-Si) devices have high electrical performance, reliability and ability to fabricate CMOS circuits and memories. If hybrid devices made from these materials are integrated on flexible substrates, flexible hybrid electronics would make great progress. In our previous work, we have proposed our own technique for transferring c-Si films onto a PET substrate by meniscus force at a low process temperature (Meniscus Force Mediated Layer Transfer: MLT) . However, in order to mass-produce devices by MLT, it is necessary to apply MLT to Roll-to-Roll process known as a method for high throughput and low cost. In this study, I attempt to make the process to perform MLT while moving the substrates.