[11p-Z03-3~12] 8.2 Plasma deposition of thin film, plasma etching and surface treatment

△ [11p-Z03-8] Fluorine injection into III-V semiconductor compounds by diffusion and knock-on

〇Yoshinori Kodama¹, Yoshifumi Zaizen¹, Masanaga Fukasawa¹, Katsuhisa Kugimiya¹, Yoshiya Hagimoto¹, Hayato Iwamoto¹ (1.Sony Semiconductor Solutions Corp.)

Keywords:etching, plasma, damage