2021年第68回応用物理学会春季学術講演会

講演情報

一般セッション(口頭講演)

15 結晶工学 » 15.6 IV族系化合物(SiC)

[18a-Z05-1~11] 15.6 IV族系化合物(SiC)

2021年3月18日(木) 09:00 〜 12:00 Z05 (Z05)

花房 宏明(広島大)、浅水 啓州(ローム)

11:00 〜 11:15

[18a-Z05-8] Improve High-Temperature Reliability at 500℃ of Ni/Nb/4H-SiC Ohmic Contact
with CF4:O2 Surface Treatment

Cuong Van Vuong1、Seiji Ishikawa1,2、Tomonori Maeda1,2、Hiroshi Sezaki1,2、Tetsuya Meguro1、Tadashi Sato1、Shin-Ichiro Kuroki1 (1.Research Institute for Nanodevice and Bio Systems, Hiroshima University、2.Phenitec Semiconductor Corp)

キーワード:Ohmic contact, high temperature reliability, Silicon Carbide, Ni/Nb, CF4:O2 etching

In this research, the high temperature stability of the Ni/Nb/4H-SiC ohmic contact at 500℃ with and without CF4:O2 surface treatment was investigated. After the fabrication process, the extracted specific contact resistance of the sample with and without CF4:O2 treatment was 1.0×10−3 Ω.cm2, and 1.6×10−3 Ω.cm2, respectively. In order to investigate the high-temperature reliability, the samples were aged at 500℃ in N2 ambient. Based on the I-V curves of the Ni/Nb/4H-SiC contact with and without surface treatment after different duration of aging time, it has showed that, just after 25-hour aging at 500℃, the sample without the surface treatment lost the ohmic behavior. Whereas, the sample with CF4:O2 surface etching shows a good stability up to after 100 hours of aging. This result shows that the Ni/Nb/4H-SiC ohmic contact with CF4:O2 surface treatment could be a potential candidate for harsh environment applications.