The 83rd JSAP Autumn Meeting 2022

Presentation information

Oral presentation

7 Beam Technology and Nanofabrication » 7.3 Micro/Nano patterning and fabrication

[20a-C101-1~13] 7.3 Micro/Nano patterning and fabrication

Tue. Sep 20, 2022 9:00 AM - 12:30 PM C101 (C101)

Jiro Yamamoto(Hitachi), Jun Taniguchi(Tokyo Univ. of Sci.)

11:30 AM - 11:45 AM

[20a-C101-10] Fabrication of self-stamding resin thin film with through holes by combined use of thermal imprint and photolithography

Hiroaki Kawata1, Masaaki Yasuda1, Yoshihiko Hirai1 (1.Osaka Metro. Univ.)

Keywords:self-standing film, through holes, nanoimprint

We have already reported on the fabrication process of a self-supporting resin thin film with fine through holes using thermal nanoimprint. However, through holes could be hardly obtained because a residual layer remained on the hole pattern bottom. In order to overcome this problem, a hybrid process that combines thermal imprinting and photolithography was developed. In this process, the residual layer produced by the thermal imprint was removed by a photolithography process. By using a hybrid process, a self-supporting PMMA / PS thin film with 0.5 μm through holes can be successfully obtained in a range of 5 mm.