The 69th JSAP Spring Meeting 2022

Presentation information

Oral presentation

13 Semiconductors » 13.7 Compound and power devices, process technology and characterization

[22a-E302-1~12] 13.7 Compound and power devices, process technology and characterization

Tue. Mar 22, 2022 9:00 AM - 12:15 PM E302 (E302)

Kozo Makiyama(Sumitomo Electric Industries, Ltd.)

9:00 AM - 9:15 AM

[22a-E302-1] Device Simulation of Output Admittance of HEMT’s

〇Koichi Fukuda1, Junichi Hattori1, Hidehiro Asai1, Tsutomu Ikegami1, Toshihide Ide1, Mitsuaki Shimizu1 (1.AIST)

Keywords:GaN HEMT, device simulation, trap level

Stable solutions of GaN HEMT output admittance deice simulation are obtained by coupling deep level trap rate equations.