The 69th JSAP Spring Meeting 2022

Presentation information

Oral presentation

13 Semiconductors » 13.7 Compound and power devices, process technology and characterization

[22a-E302-1~12] 13.7 Compound and power devices, process technology and characterization

Tue. Mar 22, 2022 9:00 AM - 12:15 PM E302 (E302)

Kozo Makiyama(Sumitomo Electric Industries, Ltd.)

9:30 AM - 9:45 AM

[22a-E302-3] Buffer Layer Impurity Dependence of Current Collapse of AlGaN/GaN HEMTs Fabricated on GaN Substrates

〇Hidemasa Takahashi1, Yuji Ando1, Akio Wakejima3, Jun Suda1,2 (1.Nagoya Univ., 2.Nagoya Univ. IMaSS, 3.NITech)

Keywords:GaN, HEMT

In order to maximize the potential of GaN, we are developing GaN-HEMTs on GaN substrates. In this study, we investigated the effect of buffer layer impurities on the frequency dispersion of drain current collapse by using HEMT epis grown on a GaN substrate with different buffer layer configurations. When the frequency dispersion of the maximum drain current was compared, a large difference was found due to the difference in buffer layer impurities.