[24p-E304-1~10] Introducing 2D Layered Materials into LSI World!

[24p-E304-10] Introducing 2D Layered Materials into LSI World!

〇Takeo Matsuki¹, Kosuke Nagashio², Hirokazu Fukidome³, Hitoshi Wakabayashi⁴, Takahiro Iizuka⁵, Ryu Hasunuma⁶, Junichi Sone⁷ (1.AIST, 2.The Univ. of Tokyo, 3.Tohoku Univ., 4.Tokyo Inst. of Tech., 5.Hiroshima Univ., 6.Univ. of Tsukuba, 7.JST)

Keywords:2D Layered Materials, 2D Materials, Large Scaled Integrated Circuit

The scaling of Si LSI is ongoing including some 3D stacked structures. The technology roadmap has been drawn until 2nm node. Otherwise, 2D layered materials was proposed as a new semiconductor material for the more scaled and integrated of LSI. The materials integration technology for the 2D layered materials has not been matured as the practical application for LSI. This panel discussion will address the research activity of the past and present including the issues, and also the future.