The 69th JSAP Spring Meeting 2022

Presentation information

Symposium (Oral)

Symposium » Introducing 2D Layered Materials into LSI World!

[24p-E304-1~10] Introducing 2D Layered Materials into LSI World!

Thu. Mar 24, 2022 1:00 PM - 5:45 PM E304 (E304)

Hirokazu Fukidome(Tohoku Univ.), Takeo Matsuki(AIST)

4:00 PM - 4:30 PM

[24p-E304-9] Persectives of device models from circuit design aspects

〇Takahiro Iizuka1 (1.Hiroshima Univ.)

Keywords:compact model, transistor, circuit simulation

Transistors built in two-dimensional materials are at their budding stage, drawing academic interests in general. The enablement of such transistors as a necessary component for integrated circuitry entails a good resource of device compact model bridging between conceptual, abstract design layer and its physical, manufacturable counterpart. This talk will survey constituent technogies for device compact model, some prospective models and provide a perspective.