The 70th JSAP Spring Meeting 2023

Session information

Oral presentation

10 Spintronics and Magnetics » 10.1 Emerging materials in spintronics and magnetics (including fabrication and characterization methodologies)

[17p-D704-1~16] 10.1 Emerging materials in spintronics and magnetics (including fabrication and characterization methodologies)

Fri. Mar 17, 2023 1:30 PM - 6:15 PM D704 (Building No. 11)

Hiroshi Naganuma(Tohoku Univ.), Kohei Hamaya(Osaka Univ.), Itoh Keita(東北大)

△:Presentation by Applicant for JSAP Young Scientists Presentation Award
▲:English Presentation
▼:Both of Above
No Mark:None of Above

1:30 PM - 2:00 PM

Mikihiko Oogane1,6, Kosuke Fujiwara2, Akitake Kanno1, Takafumi Nakano1, Hiroshi Wagatsuma2, Tadashi Arimoto4, Shigemi Mizukami5,6, Seiji Kumagai2, Hitoshi Matsuzaki1,2, Nobukazu Nakasato3, Yasuo Ando1,6 (1.Graduate School of Engineering, Tohoku Univ., 2.Spin Sensing Factory Corp., 3.Tohoku Univ. School of Medicine, 4.Konica Minolta Inc., 5.AIMR, Tohoku Univ., 6.CSIS, Tohoku Univ.)

2:30 PM - 2:45 PM

〇(D)Ryota Uesugi1, Tomoya Higo1,2,3, Susumu Minami2, Daisuke Nishio-Hamane1, Zheng Zhu1, Mihiro Asakura2, Akito Sakai1,2,3, Yoshichika Otani1,3,4, Ryotaro Arita3,4,5, Satoru Nakatsuji1,2,3,6,7 (1.ISSP, Univ. of Tokyo, 2.Dep. of Phys, Univ. of Tokyo, 3.JST CREST, 4.RIKEN CEMS, 5.RCAST, Univ, of Tokyo, 6.TSQS, Univ. of Tokyo, 7.Johns Hopkins Univ.)

×

Authenticate

Enter the password.

×

Only registered participants can view the abstract PDF.
◆Early bird registrant
Participant ID and password has been sent to your registered email address on February 27.
◆Late registrants
Participant ID and password will be included in a payment confirmation email.
» Participant Log In