[16a-B410-1~9] 13.4 Si processing /Si based thin film / MEMS / Equipment technology

△ [16a-B410-1] Fabrication and Characterization of Ni-W Films via Pulsed Reverse Plating

〇Zeyu Gu¹, Yiming Jiang¹, Tomoyuki Kurioka¹, Chun-Yi Chen¹, Masato Sone¹, Chang Tso-Fu Mark¹ (1.Tokyo Tech)

Keywords:MEMS, Ni-W alloy, Pulsed Reverse Plating

Ni-W alloys are attracting attention as a new structural material for microelectromechanical systems (MEMS) due to their superior hardness, ductility, corrosion resistance, and thermal stability . On the other hand, it is difficult to form Ni-W films with smooth surfaces and thicknesses of tens of micrometers by electroplating, which is incorporated into the MEMS fabrication process, due to secondary reactions such as hydrogen generation on the cathode side. In order to solve this problem, we focused on pulse reverse plating (PRP). By using PRP, it is possible to reduce the concentration of adsorbed species on the electrode surface, which is the cause of secondary reactions, and suppression of secondary reactions such as hydrogen generation can be expected. Therefore, in this study, we investigated the effect of plating method on the surface state and mechanical properties of Ni-W plated films.