[16p-A302-1~8] Advanced Surface and Interface Technologies for Micro and Nanoscale Fabrication

[16p-A302-8] 3D Heterogenous Channel Integration Technology for CFET Performance Balance Engineering

〇Wen Hsin Chang¹, X. R. Yu^2,3, T. C. Hong^2,4, Y. J. Lee^2,4, T. S. Chao⁴, Y. H. Wang³, T. Maeda¹ (1.AIST, 2.TSRI, 3.NCKU, 4.NYCU)

Keywords:CFET, CMOS, Bonding