The 70th JSAP Spring Meeting 2023

Presentation information

Oral presentation

8 Plasma Electronics » 8.2 Plasma deposition of thin film, plasma etching and surface treatment

[17a-A205-1~9] 8.2 Plasma deposition of thin film, plasma etching and surface treatment

Fri. Mar 17, 2023 9:00 AM - 11:30 AM A205 (Building No. 6)

Akihisa Ogino(Shizuoka Univ.)

10:45 AM - 11:00 AM

[17a-A205-7] Improvement in Etch Resistance of Hydrogenated Amorphous Carbon Films Based on Contribution Analysis of Process Parameters

〇(M1)Yusuke Ando1, Hiroki Kondo2, Kenji Ishikawa2, Takayoshi Tsutsumi2, Makoto Sekine2, Masaru Hori2 (1.Nagoya Univ. Eng., 2.Nagoya Univ. cLPS)

Keywords:amorphous carbon, CVD, machine learning

In this research, a contribution analysis of process parameters to etch resistance was conducted to improve the etch resistance of amorphous carbon, which is used as a plasma etch mask.
Machine learning analysis suggested the existence of two different types of parameters: parameters which create entire trends, and ones which affect only the vicinity of the optimized conditions.