[1Ga01-10] Thin Film (TF)

[1Ga06] Stress reduction of a-C:H films with inserting submonolayer of carbon nanoparticles

*Masaharu Shiratani¹, Shinjiro Ono¹, Manato Eri¹, Takamasa Okumura¹, Kunihiro Kamataki¹, Naoto Yamashita¹, Haruki Kiyama¹, Naho Itagaki¹, Kazunori Koga¹ (1. Graduate School of Information Science and Electrical Engineering, Kyushu University)

We have shown that the introduction of carbon nanoparticles (CNPs) between two layers of a-C:H thin films reduces film stress. In this study, we evaluated other properties of the CNP-inserted sample and examined the effect of CNPs on the mechanical properties of the film toward the practical stage. Sandwich structure films were fabricated using a capacitively coupled plasma-enhanced chemical vapor deposition (PECVD) system. Our results suggest that CNP coverage has a negative correlation with fracture toughness and that there is an optimum value for improving mechanical properties.