[1P41] Growth of vanadium dioxide thin film on fused silica glass by controlling discharge voltage in reactive sputtering
It has been known that the growth of the VO2 crystal phase showing insulator-metal transition is difficult on an amorphous glass substrate. In this study, VO2 thin film was deposited on fused silica glass substrates using a reactive direct current magnetron sputtering (r-DCMS) system. VO2 was deposited by a transient voltage change operation: the discharge voltage was initially set at 390 V and waited for 20 seconds. Then, the O2 flow rate was reduced to change the voltage to 360 V, 350 V, 340 V, or 320 V and waited for another 20 seconds. These operations were repeated during the deposition period of 10 min. By XRD, the diffraction peak from VO2 (M) (011) plane at 2θ = 27.99° was observed in the 390/350 V sample, indicating the crystal growth of VO2 thin films on a fused silica glass substrate. This sample showed the resistance change with one order of magnitude at around 68 ℃. These results suggested the growth of the VO2 (M1) phase by the transient voltage change operation.
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