JVSS 2023

Presentation information

Divisions' Session

[3Fp01-10] Latest trends of sealing inspections and leak testing: Vacuum Technologies Division's Session

Thu. Nov 2, 2023 12:30 PM - 4:15 PM F: Room223 (2F)

Chair:Tomoo Ota(Shimadzu Corporation), Junichiro Kamiya(Japan Atomic Energy Agency), Shinichi Sekiguchi(Ebara Corporation)

1:55 PM - 2:15 PM

[3Fp05] Ensuring the quality of advanced semiconductor through quadrupole mass spectrometry for extreme-small leak detection.

*Masahide Kuroiwa1, Sam Kishikawa1, Masanao Sasaki1, Yuzo Hayashi2 (1. Tokyo Electronics Co., Ltd., 2. Vaclab Inc.)

The detection of microleaks in sealed chips is very important for maintaining the quality of MEMS devices and advanced semiconductors. We have achieved the detection of microleaks using 0.2% BeCu technology, which is a material that suppresses outgassing. This innovation significantly improves precision and enables analysis in ultra-high vacuum conditions. We have developed WATMASS GA System to detect microleaks at E-16Pa m3/s (He) for sealing devices like MEMS devices and advanced semiconductors with both non-destructive and destructive methods.

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