[J-4] Ultrawide Bandgap Semiconductor Devices

Wed. Sep 28, 2022 9:00 AM - 10:15 AM 303 (3F)

Session Chair: Heiji Watanabe (Osaka Univ.), Hironori Okumura (Univ. of Tsukuba)

[J-5] SiC Processes and Characterizations

Wed. Sep 28, 2022 10:45 AM - 12:00 PM 303 (3F)

Session Chair: Kung-Yen Lee (National Taiwan Univ.), Naoki Watanabe (Hitachi, Ltd.)

Wed. Sep 28, 2022 1:30 PM - 3:45 PM 303 (3F)

Session Chair: Yuichi Onozawa (Fuji Electric Corp.), Shinsuke Harada (AIST)

Thu. Sep 29, 2022 10:45 AM - 12:00 PM 303 (3F)

Session Chair: Tetsuya Nitta (Mitsubishi Electric Corp.), Tomoaki Hatayama (Sumitomo Electric Industries, Ltd.)

Thu. Sep 29, 2022 1:30 PM - 3:00 PM 303 (3F)

Session Chair: Toru Sugiyama (Toshiba Device & Strage Corp.), Heiji Watanabe (Osaka Univ.)

Thu. Sep 29, 2022 4:00 PM - 5:45 PM 303 (3F)

Session Chair: Norikatsu Takaura (Hitachi, Ltd.), Soichi Sugiura (Micron Technology Inc.)

Tue. Sep 27, 2022 11:30 AM - 12:30 PM 304 (3F)

Session Chair: Takeyasu Saito (Osaka Metropolitan Univ.), Jenn-Ming Song (National Chung Hsing Univ.)

Oral Presentation
| 12: Advanced Circuits / Systems Interacting with Innovative Devices and Materials

Tue. Sep 27, 2022 2:00 PM - 3:15 PM 304 (3F)

Session Chair: Koh Johguchi (Shinshu Univ.), Jerald Yoo (National Univ. of Singapore)

Tue. Sep 27, 2022 4:15 PM - 5:45 PM 304 (3F)

Session Chair: Takeyasu Saito (Osaka Metropolitan Univ.), Satoshi Iwamoto (Univ. of Tokyo)

Wed. Sep 28, 2022 9:00 AM - 10:15 AM 304 (3F)

Session Chair: Takeyasu Saito (Osaka Metropolitan Univ.), Xun Gu (ASM Japan)