2018 International Conference on Solid State Devices and Materials

Sep 9, 2018 - Sep 13, 2018
University of Tokyo

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922 results (231 - 240)

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[G-3-04] Growth of Multi-Layer Graphene (MLG) Inside Si Deep Trench for 3D-LSI Application

^○M. Mariappan¹, T. Akimoto², H. Kawakami², K. Ueno², T. Fukushima¹, M. Koyanagi¹ (1.Tohoku University (Japan), 2.Shibaura Institute of Technology (Japan))

2018 International Conference on Solid State Devices and Materials |Wed. Sep 12, 2018 10:00 AM - 10:15 AM |PDF Download

[G-4-01 (Invited)] Low Temperature and Non-Vacuum Surface Modification for Robust Hybrid Bonding

^○A. Shigetou¹, T.H.-W. Yang², R. Kao¹ (1.NIMS (Japan), 2.National Taiwan Univ. (Taiwan))

2018 International Conference on Solid State Devices and Materials |Wed. Sep 12, 2018 10:45 AM - 11:15 AM |PDF Download

[G-4-02] Effect of Electroplating on Adhesion between Copper/Titanium and Polyimide in Redistribution Layers and Hybrid Bonding Scheme for Advanced Packaging Applications

^○Y.L. Yang¹, C.H. Lu¹, Y.P. Chen², C.P. Chen², T.T. Hung², C.F. Chen², K.N. Chen¹ (1.National Chiao Tung Univ. (Taiwan), 2.Taiflex Scientific Corp. (Taiwan))

2018 International Conference on Solid State Devices and Materials |Wed. Sep 12, 2018 11:15 AM - 11:30 AM |PDF Download

[G-4-03 (Late News)] X-ray Computed Tomography Studies on DSA Formed Vertical Nanocylinders Containing Metals for 3D-LSI Applications - Characterization Technique Dependent Reliability Issues

^○M. Mariappan¹, A. Takeuchi², T. Fukushima¹, M. Koyanagi¹ (1.Tohoku University (Japan), 2.JASRI (Japan))

2018 International Conference on Solid State Devices and Materials |Wed. Sep 12, 2018 11:30 AM - 11:45 AM |PDF Download

[G-6-01 (Invited)] Conductor trends for future interconnects

^○Z. Tokei¹ (1.IMEC (Belgium))

2018 International Conference on Solid State Devices and Materials |Wed. Sep 12, 2018 3:15 PM - 3:45 PM |PDF Download

[G-6-02] Control of Cu(111) orientation on TaWN alloy barrier

^○M.B. Takeyama¹, M. Sato¹, M. Yasuda² (1.Kitami Inst. of Tech. (Japan), 2.Toray Res. Center, Inc. (Japan))

2018 International Conference on Solid State Devices and Materials |Wed. Sep 12, 2018 3:45 PM - 4:00 PM |PDF Download

[G-6-03] Cu-Resistivity and Intrinsic EM-Reliability Study in Ta/Cu, Co/Cu and Ru/Cu Systems for Advanced BEOL Cu-Interconnections

^○N. Jourdan¹, O. Varela Pedreira¹, M. Van der Veen¹, C. Adelmann¹, S. Van Elshocht¹, Z. Tokei¹ (1.imec (Belgium))

2018 International Conference on Solid State Devices and Materials |Wed. Sep 12, 2018 4:00 PM - 4:15 PM |PDF Download

[G-7-01 (Invited)] MEMS Vibrational Energy Harvesters for Perpetual Electronics

^○H. Toshiyoshi¹ (1.Univ. of Tokyo (Japan))

2018 International Conference on Solid State Devices and Materials |Thu. Sep 13, 2018 9:00 AM - 9:30 AM |PDF Download

[G-7-02] Electrodeposition of High Strength Au-Cu Alloys for MEMS Device

^○T.F.M. Chang¹, H. Tang¹, K. Nitta¹, C.Y. Chen¹, T. Nagoshi², D. Yamane¹, T. Konishi³, K. Machida¹, K. Masu¹, M. Sone¹ (1.Tokyo Tech (Japan), 2.AIST (Japan), 3.NTT AT (Japan))

2018 International Conference on Solid State Devices and Materials |Thu. Sep 13, 2018 9:30 AM - 9:45 AM |PDF Download

[G-7-03] Design and fabrication of sputtered AlOx/CVD SiNx/sputtered AlOx diaphragm for Spin-MEMS microphones

^○S. Baba¹, Y. Fuji¹, A. Yuzawa¹, T. Nagata¹, K. Masunishi², Y. Higashi¹, S. Kaji¹, K. Okamoto¹, T. Ono¹, M. Hara¹ (1.Corporate R & D Center, Toshiba Corp. (Japan), 2.Corporate Manufacturing Engineering Center, Toshiba Corp. (Japan))

2018 International Conference on Solid State Devices and Materials |Thu. Sep 13, 2018 9:45 AM - 10:00 AM |PDF Download

922 results (231 - 240)

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