[PS-2-17 (Late News)] Two Phase Change Memory (2-PCM) Neuron for Implementation of Backpropagation Algorithm

^○C. Li¹, J. An¹, Y.-H. Song¹ (1.Hanyang Univ. (Korea))

2019 International Conference on Solid State Devices and Materials |2019年9月4日(水) 11:17 〜 11:19 |PDF ダウンロード

[PS-2-18 (Late News)] Current Monitor Circuit with Cascode Amplifier Using Crystalline IGZO FETs Compatible with Low-Voltage Input to Detect Micro Short-Circuit in Lithium Ion Battery

^○S. Fukai¹, M. Ito¹, K. Takahashi¹, F. Akasawa¹, T. Saito¹, M. Kozuma¹, T. Ikeda¹, T. Takeuchi¹, T. Murakawa¹, S. Yamazaki¹ (1.Semiconductor Energy Laboratory Co., Ltd. (Japan))

2019 International Conference on Solid State Devices and Materials |2019年9月4日(水) 11:19 〜 11:21 |PDF ダウンロード

[PS-2-19 (Late News)] Selectable Amplification of Sensor Using Coplanar Gate IGZO TFT with Variable Resistance Layer

^○M.-S. Kang¹, E.-K. Hong¹, W.-J. Cho¹ (1.Kwangwoon Univ. (Korea))

2019 International Conference on Solid State Devices and Materials |2019年9月4日(水) 11:21 〜 11:23 |PDF ダウンロード

[PS-2-20 (Late News)] Enhanced Electroresistance in HfZrO based Metal/ferroelectric/Semiconductor Tunnel Junction

^○Y. Goh¹, J.H. Hwang¹, G.U. Kim¹, H. Cho¹, S. Jeon¹ (1.Korea Advanced Institute of Science and Technology (KAIST) (Korea))

2019 International Conference on Solid State Devices and Materials |2019年9月4日(水) 11:23 〜 11:25 |PDF ダウンロード

[PS-3-01] Properties of barrierless Cu/ZrN_x/Si structure deposited at room temperature

^○M. Sato¹, M.B. Takeyama¹ (1.Kitami Inst. of Tech. (Japan))

2019 International Conference on Solid State Devices and Materials |2019年9月4日(水) 10:45 〜 10:47 |PDF ダウンロード

[PS-3-02] Integrated Simulation Methodology for EM-induced Circuit Degradation

^○Y. Xiao¹, H. Jiang¹, Z. Ahmed¹, Z. Ma¹, C. Prawoto¹, C.J. Estrada¹, L. Zhang², M. Chan¹ (1.The Hong Kong Univ. of Sci. and Tech. (Hong Kong), 2.Shenzhen Univ. (China))

2019 International Conference on Solid State Devices and Materials |2019年9月4日(水) 10:47 〜 10:49 |PDF ダウンロード

[PS-3-03] Amorphous-Carbon Barrier against Moisture for Copper Metallization and Effects of CF₄ Plasma Treatment

^○P. Gomasang¹, K. Ueno^1,2 (1.Shibaura Inst. of Tech. (Japan), 2.SIT Res. Center for Green Innov. (Japan))

2019 International Conference on Solid State Devices and Materials |2019年9月4日(水) 10:49 〜 10:51 |PDF ダウンロード

[PS-3-04] Design and simulation of a novel piezoresistive pressure sensor for guidewires

^○H.H.Q. Nguyen¹, W.-T. Park¹ (1.Seoul National Univ. of Sci. and Tech. (Korea))

2019 International Conference on Solid State Devices and Materials |2019年9月4日(水) 10:51 〜 10:53 |PDF ダウンロード

[PS-3-05 (Late News)] Chip-to-Wafer Gang Bonding for High Throughput 3D-Integration

^○M. Mariappan¹, T. Fukushima¹, A. Nakamura¹, J.C. Bea¹, M. Koyanagi¹ (1.Tohoku Univ. (Japan))

2019 International Conference on Solid State Devices and Materials |2019年9月4日(水) 10:53 〜 10:55 |PDF ダウンロード

[PS-4-01] Turn-Off Loss Improvement by IGBT Scaling

^○M. Fukui¹, T. Saraya¹, K. Itou¹, T. Takakura¹, S. Suzuki¹, K. Takeuchi¹, K. Kakushima², T. Hoshii², K. Tsutsui², H. Iwai², S. Nishizawa³, I. Omura⁴, T. Hiramoto¹ (1.Univ. of Tokyo (Japan), 2.Tokyo Tech (Japan), 3.Kyushu Univ. (Japan), 4.Kyushu Inst. of Tech. (Japan))

2019 International Conference on Solid State Devices and Materials |2019年9月4日(水) 10:45 〜 10:47 |PDF ダウンロード