[C-5-02] Two-Dimensional Characterization of n-GaN Schottky Contacts Printed by Using Ni Nanoink

〇Kenji Shiojima¹, Yuto Kawasumi¹, Yuto Yasui¹, Yukiyasu Kashiwagi², Toshiyuki Tamai² (1. Univ. of Fukui(Japan), 2. Osaka Res. Inst. of Indus. Sci. and Tech.(Japan))

2020 International Conference on Solid State Devices and Materials |Tue. Sep 29, 2020 2:30 PM - 2:45 PM |PDF Download

[C-5-03] PdErSi Source and Drain for Schottky Barrier MOSFET with HfO₂ Gate Insulator Fabricated by Low Thermal Budget Gate-First Process

〇Rengie Mark Domincel Mailig¹, Yuichiro Aruga¹, Shun-ichiro Ohmi¹ (1. Tokyo Tech.(Japan))

2020 International Conference on Solid State Devices and Materials |Tue. Sep 29, 2020 2:45 PM - 3:00 PM |PDF Download

[C-5-04] Evaluation of bending stress in Au-wiring formed over FHE by micro-XRD

〇Murugesan Mariappan¹, Y Susumago¹, T Odashima¹, H Kino¹, T Tanaka¹, K Sumitani², Y Imai², S Kimura², T Fukushima¹ (1. Tohoku Univ(Japan), 2. JASRI(Japan))

2020 International Conference on Solid State Devices and Materials |Tue. Sep 29, 2020 3:00 PM - 3:15 PM |PDF Download

[C-6-01 (Invited)] Novel Stacking Technologies for The Stacked CMOS Image Sensors

〇Yoshihisa Kagawa¹, Hayato Iwamoto¹ (1. Sony Semiconductor Solutions Corp.(Japan))

2020 International Conference on Solid State Devices and Materials |Tue. Sep 29, 2020 4:00 PM - 4:30 PM |PDF Download

[C-6-02] Micro-LED and PPG Sensor Integration Using Flexible Fan-Out Wafer-Level Packaging for Trans-Nail Pulse-Wave/SpO₂ Monitoring

〇Tomo Odashima¹, Yuki Susumago¹, Qian Zhengyang¹, Noriyuki Takahashi², Shuta Nagata¹, Hisashi Kino³, Tetsu Tanaka^1,2, Takafumi Fukushima^1,2 (1. Univ. of Tohoku, Mechanical Systems Engineering(Japan), 2. Univ. of Tohoku, Biomedical Engineering(Japan), 3. Univ. of Tohoku, Frontier Research Institute for Interdisciplinary Sciences(Japan))

2020 International Conference on Solid State Devices and Materials |Tue. Sep 29, 2020 4:30 PM - 4:45 PM |PDF Download

[C-6-03] Back-illuminated CMOS Image Sensor Having Both Infrared Absorbing and Blocking Pixels in a Single Chip

Yunki Lee¹, 〇Jonghoon - Park¹, Bumsuk Kim¹, Yunji Jung¹, Bomi Kim¹, Jungchak Ahn¹ (1. Samsung Electronics Co., Ltd(Korea))

2020 International Conference on Solid State Devices and Materials |Tue. Sep 29, 2020 4:45 PM - 5:00 PM |PDF Download

[C-6-04] Efficient design of Fabry–Pérot cavity based transmissive structural color filters via machine learning

〇Peng - Dai¹, C.H. de Groot¹, Otto L. Muskens¹, Huigao Duan², Ruomeng Huang¹ (1. Univ. of Southampton(UK), 2. Hunan Univ.(China))

2020 International Conference on Solid State Devices and Materials |Tue. Sep 29, 2020 5:00 PM - 5:15 PM |PDF Download

[C-6-05] High performance aluminum plasmonic filters integrated into back-illuminated CMOS image sensor for spectrometric applications

〇Hye Yeon Park¹, YunKi Lee¹, Bumsuk Kim¹, Boseong Kim¹, Jeongmin Bae¹, JungChak Ahn¹ (1. Samsung Electronics(Korea))

2020 International Conference on Solid State Devices and Materials |Tue. Sep 29, 2020 5:15 PM - 5:30 PM |PDF Download

[C-9-01 (Invited)] Hacking Blu-ray for High-Resolution 3D printing

〇En-Te Hwu¹ (1. Technical Univ. of Denmark(Denmark))

2020 International Conference on Solid State Devices and Materials |Wed. Sep 30, 2020 2:00 PM - 2:30 PM |PDF Download

[C-9-02] A High Resolution Single Gold Proof-Mass CMOS-MEMS Accelerometer

〇Takashi - Ichikawa¹, Kohei Shibata¹, Tatsuya Koga¹, Katsuyuki Machida¹, Shinichi Iida², Noboru Ishihara¹, Kazuya Masu¹, Hiroyuki Ito¹ (1. Tokyo Tech.(Japan), 2. Corp. NTT Advanced Technology(Japan))

2020 International Conference on Solid State Devices and Materials |Wed. Sep 30, 2020 2:30 PM - 2:45 PM |PDF Download