liquid-interface-dependent material properties for an artificial multiferroic system and additive manufacturing process

〇Akinobu Yamaguchi^1,7, Shunya Saegusa^1,7, Ryo Nakamura^1,7, Naoya Akamatsu^1,7, Aiko Nakao^2,1, Ikuya Sakurai³, Ikuo Okada⁴, Yuichi Utsumi¹, Takeshi Ogasawara⁵, Keisuke Yamada⁶, Masaki Oura⁷, Takuo Ohkouchi⁸ (1. Univ. of Hyogo(Japan), 2. Waseda Univ.(Japan), 3. Nagoya Univ.(Japan), 4. Aich SR.(Japan), 5. AIST(Japan), 6. Gifu Univ.(Japan), 7. RIKEN(Japan), 8. JASRI(Japan))

2020 International Conference on Solid State Devices and Materials |2020年9月28日(月) 16:45 〜 17:00 |PDF ダウンロード

[C-2-05 (Late News)] Fabrication challenges in integrating self-assembled block copolymer process in semiconductor devices

〇Sandeep Seema Saseendran¹, Abhilash Paneri¹, Bert Tobback¹, Bogumila Kutrzeba-Kotowska¹, Emma Vecchio¹, Geraldine Jamieson¹, Vasile Paraschiv¹, Hyo Seon Suh¹, Bruno Figeys¹, Masaki Fujikane², Atsushi Himeno², Kunihiko Nakamura², Naoki Tambo², Yuki Nakata², Hiroyuki Tanaka², Yasuyuki Naito², Kouhei Takahashi², Deniz S Tezcan¹ (1. IMEC vzw(Belgium), 2. Panasonic Corporation(Japan))

2020 International Conference on Solid State Devices and Materials |2020年9月28日(月) 17:00 〜 17:15 |PDF ダウンロード

[C-2-06 (Late News)] Cooling Measurement of On-Chip Inetgrated EOF Micropump Using CMOS-LSI Components

〇Yuki Okamoto^1,2, Yoshio Mita², Hiroyuki Ryoson³, Takayuki Ohba³ (1. National Institute of Advanced Industrial Science and Technology(Japan), 2. The University of Tokyo(Japan), 3. Tokyo Institute of Technology(Japan))

2020 International Conference on Solid State Devices and Materials |2020年9月28日(月) 17:15 〜 17:30 |PDF ダウンロード

[C-2-07 (Late News)] Study on relationship between nano particle agglomeration action and polishing characteristics in CMP

〇Mohammed Ahmed Yousof Abdelhakeem Bakier¹, Keisuke Suzuki¹, Panart Khajornrungruang¹ (1. Kyushu Institute of Tech.(Japan))

2020 International Conference on Solid State Devices and Materials |2020年9月28日(月) 17:30 〜 17:45 |PDF ダウンロード

[C-4-01 (Invited)] 3D-IC technology in the era of AI, IoT and Big data

〇Katsuya Kikuchi¹ (1. AIST(Japan))

2020 International Conference on Solid State Devices and Materials |2020年9月29日(火) 11:00 〜 11:30 |PDF ダウンロード

[C-4-02] Over 230 fF/μm² capacitance density 9.0V breakdown voltage textured deep trench SiN capacitors toward 3D integration

〇Koga Saito¹, Rihito Kuroda¹, Hiroshi Shibata², Taku Shibaguchi², Naoya Kuriyama², Shigetoshi Sugawa¹ (1. Tohoku University(Japan), 2. LAPIS Semiconductor Miyagi Co., Ltd.(Japan))

2020 International Conference on Solid State Devices and Materials |2020年9月29日(火) 11:30 〜 11:45 |PDF ダウンロード

[C-4-03] Bumpless Build Cube (BBCube) using Wafer-on-Wafer (WOW) Technologywith 3D-manner Redundancy Scheme

〇Shinji Sugatani¹, Norio Chujo¹, Koji Sakui¹, Hiroyuki Ryoson¹, Tomoji Nakamura¹, Takayuki Ohba¹ (1. Tokyo Institute of Technology(Japan))

2020 International Conference on Solid State Devices and Materials |2020年9月29日(火) 11:45 〜 12:00 |PDF ダウンロード

[C-4-04] Die-Level Cu-CMP Technology in Via-Last TSV Process for Multichip-to-Wafer 3D integration

〇Shuai Liu¹, Kousei Kumahara¹, Yuki Miwa¹, Hisashi Kino¹, Tetsu Tanaka¹, Takafumi Fukushima¹ (1. Tohoku Univ.(Japan))

2020 International Conference on Solid State Devices and Materials |2020年9月29日(火) 12:00 〜 12:15 |PDF ダウンロード

[C-4-05] Effect of Dielectric Layer Scheme for High-Quality Silicon Channel in Monolithic 3DIC

〇Yu Wei Liu¹, Yi Jui Chang¹, Chih Chao Yang², Chang Hong Shen², Kuan Neng Chen¹, Chenming Hu³ (1. National Chiao Tung Univ.(Taiwan), 2. Taiwan Semiconductor Res. Inst.(Taiwan), 3. Univ. of California, Berkeley(United States of America))

2020 International Conference on Solid State Devices and Materials |2020年9月29日(火) 12:15 〜 12:30 |PDF ダウンロード

[C-5-01 (Invited)] Circuit Technology for High-speed Wireline Communication

〇Hisakatsu Yamaguchi¹ (1. Fujitsu Laboratories Ltd.(Japan))

2020 International Conference on Solid State Devices and Materials |2020年9月29日(火) 14:00 〜 14:30 |PDF ダウンロード