The 61st JSAP Spring Meeting, 2014

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Oral presentation

08. Plasma Electronics » 8.4 Plasma etching

[19a-F6-1~6] 8.4 Plasma etching

Wed. Mar 19, 2014 11:00 AM - 12:30 PM F6 (F306)

11:45 AM - 12:00 PM

[19a-F6-4] Analysis of Surface Roughness during Si Etching in Inductively Coupled Cl2 Plasmas

○（D）Nobuya Nakazaki1, Haruka Matsumoto2, Yoshinori Takao1, Koji Eriguchi1, kouichi Ono1 (Kyoto Univ.1, Kyoto Univ.2)

Keywords:Si etching,Inductively coupled Cl2 plasma,Surface roughness