4:15 PM - 4:30 PM
[19p-S423-10] Alleviation of Fermi Level Pinning at Metal/Germanium Interface Based on Control of Interfacial Dipole Density
Keywords:Fermi level pinning
Presentation information
Oral presentation
13 Semiconductors » 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology
[19p-S423-1~17] 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology
Sat. Mar 19, 2016 1:45 PM - 6:15 PM S423 (S4)
Tomoji Nakamura(Fujitsu Lab.), Kuniyuki Kakushima(Titech)