The 63rd JSAP Spring Meeting, 2016

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

[20p-S423-1~19] 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

Sun. Mar 20, 2016 1:45 PM - 6:45 PM S423 (S4)

Seiichiro Higashi(Hiroshima Univ.), Akito Hara(Tohoku Gakuin Univ.)

3:15 PM - 3:30 PM

[20p-S423-7] Multi-shots ELA of sputtered Si film and TFT with metal source-drain structure

Taisei Harada1, Futa Gakiya1, Takuya Ashitomi1, Tatsuya Okada1, Takashi Noguchi1, Kanji Noda2, Akira Suwa2,3, Hiroshi Ikenoue3, Tetsuo Okuyama4 (1.Univ. of the Ryukyus, 2.GiGAPHOTON Inc., 3.Kyusyu Univ., 4.TOYOBO Co.Ltd)

Keywords:TFT,Low-temperature process,Excimer laser annealing