The 63rd JSAP Spring Meeting, 2016

Presentation information

Symposium

Symposium » Advanced Fabrication System for Metal Oixde Thin Films

[21p-S222-1~9] Advanced Fabrication System for Metal Oixde Thin Films

Mon. Mar 21, 2016 1:30 PM - 6:15 PM S222 (S2)

Tetsuya Yamamoto(Kochi Univ. of Tech.), Akira Ohtomo(Titech)

3:30 PM - 4:00 PM

[21p-S222-5] Reactive Plasma Deposition (RPD) equipment

Kimio Kinoshita1, Makoto Maehara1, Toshiyuki Sakemi1, Hisashi Kitami1 (1.Sumitomo Heavy Industries)

Keywords:Reactive Plasma Deposition,Transparent Conductive Oxide,photovoltaic cells

Reactive plasma deposition (RPD) is a commercially available ion plating system for thin film deposition that combined a pressure-gradient type plasma gun and a plasma beam controller. The major application areas are flat-panel displays and photovoltaic cells. One of the advantages of the RPD method is the formation of high-quality transparent conductive oxide films, such as indium tin oxide (ITO) and zinc oxide (ZnO).
The characteristics of RPD method is the higher ionization rates and the lower energy (10-30 eV) of depositing particles on the substrate. Due to these advantage, RPD method can form the high quality film.
In addition, the continuous target material supply system and the multiple plasma gun layout is installed in our system for the mass production.