[18a-233-1~10] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[18a-233-5] MEMS Rogowski Coil with TSV Structure for Overcurrent Detection

〇Yoshiyuki Watanabe¹, Toru Yahagi¹, Yutaka Abe¹, Hiroki Murayama¹, Shinji Kunori², Kenichi Yoshida², Kazuyuki Sashida², Daisuke Arai², Katsuya Ikeda² (1.Yamagata Inst. Tech., 2.Shindengen)

Keywords:Rogowski Coil, MEMS, TSV

We have fabricated the MEMS Rogowski coil with TSV structure for overcurrent detection in power device. The Rogowski coil having a spiral coil with a chip size of 10 × 10 × 0.3 mm ³ , TSV diameter of 100 µm, 137 turns was fabricated by MEMS process, and it was confirmed that current detection was possible.