[18a-233-1~10] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

△ [18a-233-6] A Study on Young’s Modulus of Micro-Cantilevers Fabricated by Au Electroplating for MEMS Accelerometers

〇Hideaki Nakajima¹, Tso-Fu Mark Chang¹, Chun-Yi Chen¹, Daisuke Yamane¹, Toshifumi Konishi², Katsuyuki Machida¹, Hiroshi Toshiyoshi³, Hiroyuki Ito¹, Kazuya Masu¹, Masato Sone¹ (1.Tokyo Tech., 2.NTT-AT, 3.The Univ. of Tokyo)

Keywords:MEMS, Gold, young's modulus