The 79th JSAP Autumn Meeting, 2018

Presentation information

Oral presentation

13 Semiconductors » 13.1 Fundamental properties, surface and interface, and simulations of Si related materials

[21p-135-1~16] 13.1 Fundamental properties, surface and interface, and simulations of Si related materials

Fri. Sep 21, 2018 1:00 PM - 5:15 PM 135 (135)

Tomo Ueno(TUAT), Koichiro Saga(Sony)

2:45 PM - 3:00 PM

[21p-135-8] Effect of Conduction Band Offset on Breakdown Voltage at SiO2/4H-SiC (000-1) studied by Hard X-ray Photoelectron Spectroscopy

〇(D)Efi Dwi Indari1,2, Yoshiyuki Yamashita1,2, Takahiro Nagata1, Shigenori Ueda1,3, Ryu Hasunuma4, Kikuo Yamabe4 (1.NIMS, 2.Kyushu Univ, 3.SPring-8, 4.Univ of Tsukuba)

Keywords:breakdown voltage, conduction band offset, SiO2/4H-SiC (000-1)

We investigated the effect of conduction band offset (ΔEc) on the breakdown voltage upon SiO2/4H-SiC (000-structures by means of hard x-ray photoelectron spectroscopy. For electrical measurement of metal/SiO2/4H-SiC (000-1) structures, the breakdown voltage increases with larger ΔEc. SiO2 prepared by dry oxidation procedure exhibits largest ΔEc, while wet oxidation procedure exhibits smallest ΔEc. Oxygen annealing performed after wet oxidation was effective for an increase of ΔEc, yields higher breakdown voltage. Consequently, larger ΔEc results in lower leakage current.