Fumito Imura

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Speaker, Author, Co-Author

Tue. Mar 20, 2018 1:45 PM - 4:45 PM C101 (52-101)

Oral presentation
| 13 Semiconductors
| 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[20p-C101-1~11] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

4:00 PM - 4:15 PM

[20p-C101-9] Laser-Via Process in Half-Inch Sized Package Fabricated by Minimal Fab (II)

〇Fumito Imura^1,2, Tomoaki Kageyama^1,3, Michihiro Inoue¹, Arami Saruwatari¹, Sommawan Khumpuang^1,2, Shiro Hara^1,2 (1.AIST, 2.MINIMAL, 3.Tottori Univ.)

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