The 65h JSAP Spring Meeting, 2018

Presentation information

Symposium (Oral)

Symposium » Semiconductor Device Simulation: Applications and Future Perspectives

[18p-A202-1~15] Semiconductor Device Simulation: Applications and Future Perspectives

Sun. Mar 18, 2018 1:15 PM - 6:40 PM A202 (54-202)

Nobuya Mori(Osaka Univ.), Koichi Fukuda(AIST), Akira Hiroki(Kyoto Inst. of Tech.), Kenichiro Sonoda(Renesas), Nobutoshi Aoki(Toshiba Memory)

5:45 PM - 6:00 PM

[18p-A202-12] Device Simulation of Reliability for Advanced Semiconductor Devices

Takamitsu Ishihara1, Kazuya Matsuzawa1, Takeshi Naito2, Sadayuki Yoshitomi2 (1.Inst. of MemoryTech. R&D, Toshiba Memory Corp., 2.Memory Devision,Toshiba Memory Corp.)

Keywords:reliability, device simulation, ESD

Reliability of LSI has become an important technological issue as the devie-size scaling. ESD, electro-migration, NBTI/PBTI are the typical origin of reliability degradation. We have sucessfully established the device simulation of the accurate estimation of ESD by reproducing the experimental results of pulse-number of breakdown based on the modeling of the gate dielectric breakdown. The device simulation of the reliability-worse place of the circuit found by the circuit reliability simulation enables the circuit design of reliability with a good prospects.