The 80th JSAP Autumn Meeting 2019

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si processing /Si based thin film / MEMS / Equipment technology

[19a-E304-1~12] 13.4 Si processing /Si based thin film / MEMS / Equipment technology

Thu. Sep 19, 2019 9:00 AM - 12:00 PM E304 (E304)

Reo Kometani(Univ. of Tokyo), Fukushima Takafumi(Tohoku University)

11:00 AM - 11:15 AM

[19a-E304-9] Fine Patterning on Roll Surface Using Photolithography for Frosted Aluminum Plate

Hideto Yuge1, Hiroaki Suzuki1, 〇Minoru Sasaki1 (1.Toyota Technol. Inst.)

Keywords:micro/nano-patterning, rolling, 3-dimensional photolithography

The mechanical- or laser-machining has been used for making dimples or reliefs on the roller surface for texturing. However, since these methods are single point machining, the finer the pattern the smaller the machining area. The expanding processing time actually limits the applications. Here, a new technique of 3-dimensionl photolithography is introduced. The conventional photolithography is only effective to the planer sample. Newly introduced is a sheet. On that, the photoresist is spin-coated and the patterning is finished. Then, this sheet is pasted on the roller surface. After dissolving the base sheet layer and the subsequent development of the resist, the resist pattern is obtained. The wet etching of the roller steel gives the fine relief. The designed 6 convex ring arrays are obtained. The ring outer diameters are 26-76 mm and their array pitches are 28-84 mm in design realizing the fine patterns. The pattern transfer from the roller to the aluminum plate is confirmed.