The 80th JSAP Autumn Meeting 2019

Presentation information

Oral presentation

13 Semiconductors » 13.3 Insulator technology

[19p-E305-1~15] 13.3 Insulator technology

Thu. Sep 19, 2019 1:45 PM - 5:45 PM E305 (E305)

Toshifumi Irisawa(AIST), Kiyoteru Kobayashi(Tokai Univ.)

2:45 PM - 3:00 PM

[19p-E305-5] Effect of Hydrogen Neutral Beam Treatment on Atomic layer deposition SiO2

HuaHsuan Chen1, Bei Bei Ge1, Susumu Toko1, Daisuke Ohori1, Takuya Ozaki1, Tomohiro Kubota2, Mitsuya Utsuno2, Toshihisa Nozawa2, Seiji Samukawa3 (1.IFS,Tohoku Univ., 2.ASM Japan K.K., 3.AIMR, Tohoku Univ.)

Keywords:atomic layer deposition, neutral beam, silicon dioxide

In this study, some results of a novel deposition technique, neutral beam enhanced atomic layer deposition (NBEALD), are presented. We used this novel technique which utilizes neutral beam technology in atomic layer deposition to deposit high-quality SiO2 layer using precursor Aminosilane and O2 neutral beam at low substrate temperature near room temperature (30℃). The results demonstrate typical ALD process and good thickness control at angstrom level. Film properties such as chemical composition, surface roughness, uniformity, electrical property and wet etch rate for different experiment conditions are compared and discussed in this study. In addition, we present a way to improve the film quality which uses the hydrogen neutral beam post-treatment after NBEALD deposition.