The 80th JSAP Autumn Meeting 2019

Presentation information

Symposium (Oral)

Symposium (technical) » Etching Technology for Nitride Semiconductors: recent progress in high-controllable and low-damaging process

[20p-E301-1~9] Etching Technology for Nitride Semiconductors: recent progress in high-controllable and low-damaging process

Fri. Sep 20, 2019 1:30 PM - 5:35 PM E301 (E301)

Masashi Kato(Nagoya Inst. of Tech.), Taketomo Sato(Hokkaido Univ.)

2:05 PM - 2:35 PM

[20p-E301-3] Atomic Scale Processing
for GaN Devices

Shohei Ito1, Agnieszka Kurek1, Mike Cooke1 (1.Oxford Instruments)

Keywords:ALE, ALD, GaN

GaN substrate can be produce higly effecient MIS-HEMT (Metal Insulator Semiconductor High Electron Mobility Transistor) debvices.
Also GaN surface is one of the most process sensitive in the electronic industry due to easy oxidation.
our target goal to achieve careful, and controlled process at the GaN surface for best device perfomance by using ALD/ALE process.
Atomic Scale Processing for GaN Devices