The 66th JSAP Spring Meeting, 2019

Presentation information

Oral presentation

13 Semiconductors » 13.5 Semiconductor devices/ Interconnect/ Integration technologies

[10p-S221-1~10] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

Sun. Mar 10, 2019 1:45 PM - 5:00 PM S221 (S221)

Toshifumi Irisawa(AIST), Ken Uchida(Univ. Tokyo)

2:00 PM - 2:30 PM

[10p-S221-2] [INVITED] Heavy-Ion Soft-Errors in Back-Biased Thin-BOX SOI SRAMs: Hundredfold Sensitivity due to Line-Type Multi-Cell Upsets

Daisuke Kobayashi1, Kazuyuki Hirose1, Taichi Ito2, Yuya Kakehashi2, Osamu Kawasaki2, Takahiro Makino3, Takeshi Ohshima3, Daisuke Matsuura4, Takanori Narita4, Masahiro Kato4, Shigeru Ishii4, Kazunori Masukawa4 (1.ISAS/JAXA, 2.R&D/JAXA, 3.QST, 4.MHI Ltd.)

Keywords:soft error, SOI, IoT

We are sincerely honored to hear that 10th Silicon Technology Division Award is given to our paper, which has the same title as this talk. Showing recent findings, some of which were reported in previous JSAP meetings, this talk reviews the paper, in which a new soft error mechanism is suggested. Due to this mechanism, the well-known textbook model of SOI soft error no longer remains applicable in some cases. In the cases, the noise generated by radiation below the buried oxide layer is no longer negligible, leading to undesired flips of logic values stored in circuits fabricated above the buried oxide layer.