The 66th JSAP Spring Meeting, 2019

Presentation information

Oral presentation

13 Semiconductors » 13.1 Fundamental properties, surface and interface, and simulations of Si related materials

[10p-W934-1~12] 13.1 Fundamental properties, surface and interface, and simulations of Si related materials

Sun. Mar 10, 2019 1:30 PM - 4:45 PM W934 (W934)

Koichiro Saga(Sony), Nobuya Mori(Osaka Univ.)

3:15 PM - 3:30 PM

[10p-W934-7] Domain Divided Device Simulation with Flexible Boundary Conditions

Kazuya Matsuzawa1, Masatoshi Abe1, Yoshinori Oda1, Takahisa Tanaka1,2, Ken Uchida1,2 (1.TRDEC, Keio Univ., 2.Elec.Eng. Keio Univ.)

Keywords:device simulation, domain division, boundary condition

Simulation of a device is divided into several regions. Physical values at each grid on a surface of a neighboring region are used for boundary conditions of the conducting region. Each region is sequentially simulated as the boundary conditions are changed from Neumann to Dirichlet boundary conditions. The present approach makes the device simulation for large structures with one core on MPU.